Reflow Zone: The reflow zone allows the temperature to rise again (by 3 every 1 second) till it reaches the spike value so that the applied solder begins to melt and start wetting with the copper surface which helps in creating better solder joints.Ĭooling Zone: The cooling zone is the profile where no additional heat is applied to the PCB and air is supplied to supplement the cooling process such that the temperature is decreased at a rate of 4 at every 2 seconds so that the freshly created solder joint is solidified.ĭifferent types of solder have different reflow profiles. Soak Zone: In the Soak zone, the temperature achieved through preheat zone is maintained so that the FLUX applied on the board is activated and constant temperatures can be maintained for all components present on the board. Hence to prevent this, the PCB is subjected to preheating where the temperature is increased by 3 every 1 second. It cannot be subjected to high heat suddenly as there is the risk of thermal shock which can cause the components on the board to explode, melt or become nonfunctional. Preheat Zone: Initially the PCB is at room temperature. The reflow profiles are divided into four zones: Reflow profiling is used to optimize the soldering process by minimizing the drastic change in temperatures which might cause cold solder joints, charred boards, tombstoning and uneven wetting. In the reflow soldering process, the board with solder should be heated in a way to ensure that the solder melts and solidifies at particular temperatures over specific periods of time to ensure proper solder joints are formed. Reflow profiling is the process of evaluating the effect of heat on the solder being used on a printed circuit board.
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